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Bond Hill based tech company hosting open house | Business

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Bond Hill based tech company hosting open house
Business
Bond Hill based tech company hosting open house

BOND HILL, OH (FOX19) - Cincinnati-based TechSolve Inc., has more than sixty years of advanced machining technology research and development experience.  On August 21, TechSolve will host an open house at their M. Eugene Merchant Technology Development Center for local manufacturers to view demonstrations in some of the newest machining processes.

“TechSolve is not just a machine shop, but rather a technology development center. The machinability studies and optimization assessments that will be a part of this open house provide practical solutions to manufacturers’ specific challenges,” TechSolve president, Gary Conley said.

The newest demonstration to be featured includes the Keyence Digital Microscope, a device that can create 3D surface models, and which is capable of 200X magnification.

Attendees will have full access to TechSolve’s machining experts and resources across a broad spectrum of machine types without tying up their own shop production.  Additionally, the event is free to attend.

The state of the art M. Eugene Merchant Technology Development Center was named in 1998, for the machining industry legend. Dr. Merchant worked all of his adult life in Cincinnati, and was considered a giant in worldwide manufacturing. Dr. Merchant worked at Milacron for nearly 50 years, and then came to TechSolve after he “retired” at the age of 70. Even at 89, this mild-mannered scientist came to work every day as a senior machining advisor at TechSolve. A film reel from the 1950’s featuring Merchant has been restored for showing at the open house.

To register for this event, please go to www.TechSolve.org/events.

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